세계의 반도체 조립 및 포장 서비스 시장 2020-2024

■ 영문 제목 : Global Semiconductor Assembly and Packaging Services Market 2020-2024

Technavio가 발행한 조사보고서이며, 코드는 IRTNTR46417 입니다.■ 상품코드 : IRTNTR46417
■ 조사/발행회사 : Technavio
■ 발행일 : 2020년 12월
■ 페이지수 : 약120
■ 작성언어 : 영어
■ 보고서 형태 : PDF
■ 납품 방식 : E메일
■ 조사대상 지역 : 세계
■ 산업 분야 : 산업
■ 판매가격 / 옵션 (부가세별도)
Single User (1명 열람용)USD2,500 ⇒환산₩2,750,000견적의뢰/주문/질문
Five User (5명 열람용)USD3,000 ⇒환산₩3,300,000견적의뢰/주문/질문
Enterprise License (동일기업내 공유가능)USD4,000 ⇒환산₩4,400,000견적의뢰/구입/질문
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■ 보고서 개요

Global Semiconductor Assembly And Packaging Services Market 2020-2024Technavio has been monitoring the semiconductor assembly and packaging services market and it is poised to grow by $ 11.33 bn during 2020-2024, progressing at a CAGR of 3% during the forecast period. Our report on the semiconductor assembly and packaging services market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the growing demand for semiconductor wafers, large-scale use of polymer adhesive technology, and development of 3D chip packaging, FIWLP, and FOWLP technology. In addition, the growing demand for semiconductor wafers is anticipated to boost the growth of the market as well.
The semiconductor assembly and packaging services market analysis includes type segment, application segment, service provider segment, and geographical landscapes.

Technavio’s semiconductor assembly and packaging services market is segmented as below:
By Type
• WLP
• Die level packaging

By Application
• Communication sector
• Industrial and automotive sector
• Computing and networking sector
• Consumer electronics sector

By Service Provider
• OSATs
• IDMs
• Foundries

By Geographic Landscapes
• APAC
• North America
• Europe
• South America
• MEA

This study identifies the development of 3D chip packaging, FIWLP, and FOWLP technology as one of the prime reasons driving the semiconductor assembly and packaging services market growth during the next few years.
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on semiconductor assembly and packaging services market covers the following areas:
• Semiconductor assembly and packaging services market sizing
• Semiconductor assembly and packaging services market forecast
• Semiconductor assembly and packaging services market industry analysis

Technavio’s robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor assembly and packaging services market vendors that include Amkor Technology Inc., ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., HANA Micron Inc. , Intel Corp., King Yuan Electronic Corp. Ltd., Samsung Electro-Mechanics Co. Ltd., Siliconware Precision Industries Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., and Tongfu Microelectronics Co. Ltd. Also, the semiconductor assembly and packaging services market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors. For further information on this report, please visit – www.technavio.com/report/semiconductor-assembly-and-packaging-services-market-industry-analysis
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research – both primary and secondary. Technavio’s market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.

■ 보고서 목차

• Executive Summary
o Market Overview
• Market Landscape
o Market ecosystem
o Value chain analysis
• Market Sizing
o Market definition
o Market segment analysis
o Market size 2019
o Market outlook: Forecast for 2019 – 2024
• Five Forces Analysis
o Five forces analysis
o Bargaining power of buyers
o Bargaining power of suppliers
o Threat of new entrants
o Threat of substitutes
o Threat of rivalry
o Market condition
• Market Segmentation by Application
o Market segments
o Comparison by Application
o Communication sector – Market size and forecast 2019-2024
o Industrial and automotive sector – Market size and forecast 2019-2024
o Computing and networking sector – Market size and forecast 2019-2024
o Consumer electronics sector – Market size and forecast 2019-2024
o Market opportunity by Application
• Market Segmentation by Type
o Market segments
o Comparison by Type
o WLP – Market size and forecast 2019-2024
o Die level packaging – Market size and forecast 2019-2024
o Market opportunity by Type
• By Service provider
o OSATs
o IDMs
o Foundries
• Customer landscape
• Geographic Landscape
o Geographic segmentation
o Geographic comparison
o APAC – Market size and forecast 2019-2024
o North America – Market size and forecast 2019-2024
o Europe – Market size and forecast 2019-2024
o South America – Market size and forecast 2019-2024
o MEA – Market size and forecast 2019-2024
o Key leading countries
o Market opportunity by geography
o Market drivers
o Market challenges
o Market trends
• Vendor Landscape
o Vendor landscape
o Landscape disruption
• Vendor Analysis
o Vendors covered
o Market positioning of vendors
o Amkor Technology Inc.
o ASE Technology Holding Co. Ltd.
o ChipMOS TECHNOLOGIES Inc.
o HANA Micron Inc.
o Intel Corp.
o King Yuan Electronic Corp. Ltd.
o Samsung Electro-Mechanics Co. Ltd.
o Siliconware Precision Industries Co. Ltd.
o Taiwan Semiconductor Manufacturing Co. Ltd.
o Tongfu Microelectronics Co. Ltd.
• Appendix
o Scope of the report
o Currency conversion rates for US$
o Research methodology
o List of abbreviations
Exhibit
• 1: Key Finding 1
• 2: Key Finding 2
• 3: Key Finding 3
• 4: Key Finding 5
• 5: Key Finding 6
• 6: Key Finding 7
• 7: Key Finding 8
• 8: Key Finding 9
• 9: Parent market
• 10: Market characteristics
• 11: Offerings of vendors included in the market definition
• 12: Market segments
• 13: Global – Market size and forecast 2019 – 2024 ($ million)
• 14: Global market: Year-over-year growth 2019 – 2024 (%)
• 15: Five forces analysis 2019 & 2024
• 16: Bargaining power of buyers
• 17: Bargaining power of suppliers
• 18: Threat of new entrants
• 19: Threat of substitutes
• 20: Threat of rivalry
• 21: Market condition – Five forces 2019
• 22: Application – Market share 2019-2024 (%)
• 23: Comparison by Application
• 24: Communication sector – Market size and forecast 2019-2024 ($ million)
• 25: Communication sector – Year-over-year growth 2019-2024 (%)
• 26: Industrial and automotive sector – Market size and forecast 2019-2024 ($ million)
• 27: Industrial and automotive sector – Year-over-year growth 2019-2024 (%)
• 28: Computing and networking sector – Market size and forecast 2019-2024 ($ million)
• 29: Computing and networking sector – Year-over-year growth 2019-2024 (%)
• 30: Consumer electronics sector – Market size and forecast 2019-2024 ($ million)
• 31: Consumer electronics sector – Year-over-year growth 2019-2024 (%)
• 32: Market opportunity by Application
• 33: Type – Market share 2019-2024 (%)
• 34: Comparison by Type
• 35: WLP – Market size and forecast 2019-2024 ($ million)
• 36: WLP – Year-over-year growth 2019-2024 (%)
• 37: Die level packaging – Market size and forecast 2019-2024 ($ million)
• 38: Die level packaging – Year-over-year growth 2019-2024 (%)
• 39: Market opportunity by Type
• 40: Customer landscape
• 41: Market share by geography 2019-2024 (%)
• 42: Geographic comparison
• 43: APAC – Market size and forecast 2019-2024 ($ million)
• 44: APAC – Year-over-year growth 2019-2024 (%)
• 45: North America – Market size and forecast 2019-2024 ($ million)
• 46: North America – Year-over-year growth 2019-2024 (%)
• 47: Europe – Market size and forecast 2019-2024 ($ million)
• 48: Europe – Year-over-year growth 2019-2024 (%)
• 49: South America – Market size and forecast 2019-2024 ($ million)
• 50: South America – Year-over-year growth 2019-2024 (%)
• 51: MEA – Market size and forecast 2019-2024 ($ million)
• 52: MEA – Year-over-year growth 2019-2024 (%)
• 53: Key leading countries
• 54: Market opportunity by geography ($ million)
• 55: Impact of drivers and challenges
• 56: Vendor landscape
• 57: Landscape disruption
• 58: Industry risks
• 59: Vendors covered
• 60: Market positioning of vendors
• 61: Amkor Technology Inc. – Overview
• 62: Amkor Technology Inc. – Product and service
• 63: Amkor Technology Inc. – Key offerings
• 64: Amkor Technology Inc. – Key customers
• 65: Amkor Technology Inc. – Segment focus
• 66: ASE Technology Holding Co. Ltd. – Overview
• 67: ASE Technology Holding Co. Ltd. – Business segments
• 68: ASE Technology Holding Co. Ltd. – Key offerings
• 69: ASE Technology Holding Co. Ltd. – Key customers
• 70: ASE Technology Holding Co. Ltd. – Segment focus
• 71: ChipMOS TECHNOLOGIES Inc. – Overview
• 72: ChipMOS TECHNOLOGIES Inc. – Business segments
• 73: ChipMOS TECHNOLOGIES Inc. – Key offerings
• 74: ChipMOS TECHNOLOGIES Inc. – Key customers
• 75: ChipMOS TECHNOLOGIES Inc. – Segment focus
• 76: HANA Micron Inc. – Overview
• 77: HANA Micron Inc. – Product and service
• 78: HANA Micron Inc. – Key offerings
• 79: HANA Micron Inc. – Key customers
• 80: HANA Micron Inc. – Segment focus
• 81: Intel Corp. – Overview
• 82: Intel Corp. – Business segments
• 83: Intel Corp. – Key offerings
• 84: Intel Corp. – Key customers
• 85: Intel Corp. – Segment focus
• 86: King Yuan Electronic Corp. Ltd. – Overview
• 87: King Yuan Electronic Corp. Ltd. – Product and service
• 88: King Yuan Electronic Corp. Ltd. – Key offerings
• 89: King Yuan Electronic Corp. Ltd. – Key customers
• 90: King Yuan Electronic Corp. Ltd. – Segment focus
• 91: Samsung Electro-Mechanics Co. Ltd. – Overview
• 92: Samsung Electro-Mechanics Co. Ltd. – Business segments
• 93: Samsung Electro-Mechanics Co. Ltd. – Key offerings
• 94: Samsung Electro-Mechanics Co. Ltd. – Key customers
• 95: Samsung Electro-Mechanics Co. Ltd. – Segment focus
• 96: Siliconware Precision Industries Co. Ltd. – Overview
• 97: Siliconware Precision Industries Co. Ltd. – Business segments
• 98: Siliconware Precision Industries Co. Ltd. – Key offerings
• 99: Siliconware Precision Industries Co. Ltd. – Key customers
• 100: Siliconware Precision Industries Co. Ltd. – Segment focus
• 101: Taiwan Semiconductor Manufacturing Co. Ltd. – Overview
• 102: Taiwan Semiconductor Manufacturing Co. Ltd. – Business segments
• 103: Taiwan Semiconductor Manufacturing Co. Ltd. – Key offerings
• 104: Taiwan Semiconductor Manufacturing Co. Ltd. – Key customers
• 105: Taiwan Semiconductor Manufacturing Co. Ltd. – Segment focus
• 106: Tongfu Microelectronics Co. Ltd. – Overview
• 107: Tongfu Microelectronics Co. Ltd. – Product and service
• 108: Tongfu Microelectronics Co. Ltd. – Key offerings
• 109: Tongfu Microelectronics Co. Ltd. – Key customers
• 110: Tongfu Microelectronics Co. Ltd. – Segment focus
• 111: Currency conversion rates for US$
• 112: Research Methodology
• 113: Validation techniques employed for market sizing
• 114: Information sources
• 115: List of abbreviations



■ 기재된 기업 리스트

Amkor Technology Inc., ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., HANA Micron Inc. , Intel Corp., King Yuan Electronic Corp. Ltd., Samsung Electro-Mechanics Co. Ltd., Siliconware Precision Industries Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., Tongfu Microelectronics Co. Ltd.
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